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FIGURE 57.21 Schematic illustration of the strain in the solder during a thermal cycle for leaded and leadless surface-mount components. (After W. Engelmaier) (IPCTP-797, Surface Mount Solder Joint Long-term Reliability: Design, Testing, Prediction.)

One way to measure the resistance of a potentiometer without an A-to-D converter is to charge a capacitor to a known voltage and then discharge it through a resistor until it gets down to a known, specific voltage. The time it takes for the capacitor to discharge will be a function of the resistance of the potentiometer. The relationship is not strictly linear, but it is good enough for our immediate purposes.

Ball grid arrays (BGAs) are a new style of leadless SMT component with an areal array of solder joints. The reliability of these components has come under intensive study. Plastic BGAs are less susceptible to solder joint fatigue failures than ceramic BGAs because the laminate and plastic body match the CTE of the PCB much better.At this time, it seems that there will be size and power limitations to ensure solder joint reliability. Lead Compliance. As described, leadless components cause more reliability problems than leaded components because the entire displacement is imposed on the solder joint; however, there are also large differences in compliancy among leaded surface-mount components (see Fig. 57.22). Body height plays an important role because it determines the length of the

ith the knowledge gained from the earlier chapters, you should be able to build a functionally rich data-entry application with various pages, navigation between those pages, and an assortment of different UI components. The next step is to build on top of those core skills and introduce some of the more advanced features of the ADF View layer that can be used to take your application to the next level.

FIGURE 57.22 Schematic illustration of different surface-mount component lead types with widely differing compliance: (left) J-lead, (right) gullwing leads.

compliant beam. Other important lead characteristics that affect compliance are lead shape (e.g., J-lead vs. gullwing) and lead thickness (stiffness is proportional to thickness cubed). Lead frame material also plays a role in determining solder joint life, although it is not as important as lead frame geometry. Common lead frame materials are Cu and Alloy 42 (Fe42Ni); Alloy 42 has a better CTE match to silicon (and a greater mismatch to the solder), but it is much stiffer than Cu (see Table 57.3) Thin small-outline packages (TSOPs), which are becoming increasingly common memory packages, pose the greatest solder joint reliability risks of any packages commonly used today. These packages generally have Alloy 42 lead frames and very low standoff from the PCB, resulting in a very stiff lead that transfers most of the relative displacement between the component and the substrate to the solder joint. The situation is exaggerated for this component because the overall CTE of the package is quite low. While adequate solder joint reliability can be achieved with TSOPs in many situations, some vendors have opted to encapsulate the solder joints with a filled epoxy to better distribute the stresses.40 57.5.3.2 Component Selection for Cleanliness. If fluid cleaning is used to remove flux residues after assembly, then a minimum component standoff (distance between the component body and the seating plane of the leads) is critical to ensuring proper cleaning and drying, and, therefore, resistance to corrosion and moisture-related failures. Industry standards for low standoff components permit the components to have 0 0.25 mm standoff from the board. These low standoffs permit corrosive residues and the cleaning fluid to be trapped

TABLE 57.3 CTE and Elastic Modulus at Room Temperature of Some Important Packaging Materials Cu CTE, ppm/ C E, GPa 17 130 Alloy 42 (Fe-42Ni) 5 145 63Sn-37Pb Solder 25 35 Si 3.5 113

When a Propeller line is high, it is at 33 volts It switches from high to low at half this voltage, or 165 volts These two facts are the basis for the resistance determination Our task is to measure the time it takes for the capacitor to go from 33 volts to 165 volts We do this by connecting the capacitor to a line of the Propeller In our program we are using line P19 By making this line an output (high) and waiting a few milliseconds, we charge the capacitor attached to it to 33 volts We then turn the line into an input and turn on a timer immediately We monitor the state of the input pin As soon as it goes low (at 165 volts), we read the timer again.