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Although there have been few systematic comparisons made, it is general wisdom that when the intermetallic layers are very thick, solder joint reliability is reduced While solder joint thermal fatigue mostly involves cracking in the solder, the intermetallics can affect their ability to withstand mechanical stresses, particularly in tension The Ni-Sn intermetallics are particularly brittle In every case, an effort should be made to minimize the total time the solder is molten during processing and to minimize the time above about 150 C once the solder joint is formed 57522 Other Solders A number of other solders are used in specialized applications, including 80Sn-20Pb for lead finishes, 50In-50Pb for solder on thick Au, high-Pb solders such as 95Pb-5Sn and 97Pb-3Sn for flip-chip assemblies (usually on ceramic substrates), and lowtemperature solders such as 58Bi-42Sn and 52In-48In, where hierarchical soldering is desirable Further information can be found in Refs.

meaning that we will need the ability to read two potentiometers into our experiments. This will allow us to vary two variables in real time when we need to without having to change the experimental setup. We will not discuss a two-potentiometer setup in this chapter, but our experimental setups will have the ability to use two variable inputs. Reading the second potentiometer is similar to reading the first one.

23, 24, and 38 57523 Conductive Adhesives Electrically conductive adhesives are used today for specialized applications such as connections to LCD displays and attachment of small resistors and capacitors These materials consist of conductive particles, usually silver flakes or carbon, suspended in a polymer matrix, most commonly epoxy The electrical resistance of the contact to the PCB tends to be unstable over time, so these materials are not suitable for applications requiring a constant, low-resistance contact The primary failure mechanism is moisture migration through the epoxy to the interface, resulting in oxidation of the contact metal Adhesion strength is also a reliability concern New materials suitable for a broader range of applications are under development Further information can be found in Ref 39..

Components Components and their packages influence many of the field failures of electronic assemblies. Packages are primarily designed and selected for their ability to protect the electronic components inside; for example, ceramic packages may be selected over plastic ones for their greater hermeticity.This section will discuss the ways in which package selection can influence solder joint and cleanliness-related failures. 57.5.3.1 Package Selection to Minimize Solder Joint Thermal and Mechanical Failures. Minimizing solder joint thermal and mechanical fatigue failures means minimizing the global and local mismatches in the system and introducing compliance that minimizes the stresses and strains transmitted to the solder joints. Figure 57.21 illustrates the important features of these systems. The following describes how component parameters can influence the incidence of solder joint failures. Surface-Mount Technology vs. Through-Hole Components. Although there is little compliance in the system, the reliability of through-hole solder joints generally exceeds that of surface-mount joints in thermal fatigue (assuming good solder fillets are present in both cases), because the loading geometry makes it difficult for a crack to propagate far enough to cause an electrical failure. However, the PTHs themselves may be susceptible to failure if they are exposed to even a few thermal cycles well above Tg.

Plastic vs. Ceramic Package. The global mismatch between the component body and substrate is minimized for most printed circuit boards if the package is plastic rather than ceramic. Most electronic ceramics have CTEs in the neighborhood of 4 to 10 ppm. Since the printed circuit board CTE is 14 to 18 ppm in-plane below Tg, the match to plastic packages which usually have average CTEs of 20 to 25 is better. The overall CTE of a plastic package can be significantly below that of the plastic if the die is large compared to the total package body. For example, TSOP components can have overall CTEs as low as 5.5 ppm. It is also worth recalling that component-level reliability must be considered; plastic packages suffer from other disadvantages versus ceramic packages, such as moisture absorption. Leaded vs. Leadless Surface-Mount Components. Leadless surface-mount components with peripheral solder joints (e.g., leadless ceramic chip carriers, LCCCs) are more susceptible to solder joint failures due to thermal and mechanical stresses than leaded components because there is no compliance in the system (see Fig. 57.21). A compliant lead can take up relative displacement between the component body and the substrate during mechanical or thermal stressing. In doing so, it minimizes the stress and strain imposed on the solder joint, thus reducing the likelihood of failures. Large leadless components should be avoided whenever possible. If they must be used, the substrate must have as close a CTE mismatch as possible and be protected from mechanical stresses. A conformal coating should be considered.

Shear stress Heating Stress relaxation at Tmax Heating Cooling Stress relaxation at Tmin Cooling Solder yield stress