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mounted on a board of a certain thickness. FEA was used to determine the joint-to-board strain ratio for each case, which in turn can be used to determine which strain gauge location is most or least sensitive to board flexure. The results of the simulation are shown in Fig. 59.22. The results indicate that the highest sensitivity to solder joint strain is obtained at locations 1 and 3 (see Fig. 59.21). Location 2 reflects the global bending of the entire assembly. These results are in line with measured experimental data. The absolute strain value and the change in strain at location 2 is least sensitive to the critical solder joint failure strain. 59.4.2.2 Effect of Package Pad Size on Joint-to-Board Strain. FEA can also been used to estimate the effect of changes in solder joint pad size on the joint-to-board strain ratio.Two different package pad sizes were used: 0.53 mm, solder mask defined, (pad design 1) and 0.4 mm, solder mask defined, (pad design 2) while the PCB pad design was kept constant (0.5 mm, non-solder mask defined) The results in terms of the joint-to-board strain at location 3 are shown in Fig. 59.23. The results in Fig. 59.23 indicate that pad size change could have a significant impact on the strain in critical solder joints. As a result, care should be taken in using data generated with one pad size to qualify or accept the bending strength with another pad size, unless the absolute strain-to-failure value is much higher than the required strength. rdlc ean 128 Packages matching GS1-128 - NuGet Gallery
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generate GS1 - 128 using C# barcode SDK, create EAN/ UCC - 128 using C# barcode component, make EAN128 using C# barcode DLL, generate GS1 - 128 using ... Board Strain vs Joint Strain - 2.35mm PCB 4250 4000 3750 3500 3250 3000 2750 Board Strain 2500 2250 2000 1750 1500 1250 1000 750 500 250 0 0 2500 5000 7500 10000 12500 15000 17500 20000 22500 25000 27500 30000 32500 Joint Strain Summary FIGURE 59.23 Two different solder joint pad sizes analyzed. The results indicate that for the same PWB strain, the solder joint strain is ~18 percent higher for pad design 2 as compared to pad design 1. Pad Design 1 - (Loc 3) Pad Design 2 - (Loc 3) rdlc gs1 128 GS1 - 128 / EAN - 128 Barcode Generation SDK for RDLC
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RDLC GS1-128 barcode control helps .NET users to print high quality GS1-128 barcodes using VB.NET codes on RDLC local reports. This barcode generation ... 1. Zienkiewicz, O. C., Taylor, R. L., and Zhu, J. Z., The Finite Element Method: Its Basis and Fundamentals, 6th ed., Butterworth-Heinemann, 2005. 2. PC-9701, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments, IPC, January 2002. 3. IPC-9701A, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments, IPC, February 2006. 4. Clech, J-P., Noctor, D. M., Manock, J. C., Lynott, G. W., and Bader, F. E., Surface Mount Assembly Failure Statistics and Failure Free Time, Electronic Components and Technology Conference, 1994, pp. 487 497. 5. Weibull, W., A Statistical Distribution Function of Wide Applicability, Journal of Applied Mechanics, September 1951, pp. 293 297. 6. Reliasoft Corporation, Weibull Probability Density Function, 1996 2006, available online at http://www.weibull.com/LifeDataWeb/weibull_probability_density_function. htm. The data is read from within the program with the following code: rdlc ean 128 RDLC GS1-128 .NET Barcode Generation Control - TarCode.com
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18 Mar 2019 ... Hello everyone,. I would like to print barcodes for each item in my inventory. I want to create an RDLC report which will contain barcode (as an ... 7 Idem, What Are Confidence Bounds 1996 2006, available online at http://www weibullcom/LifeDataWeb/what_are_confidence_intervals_or_bounds_htm 8 Lau, J H (ed), Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, 1993 9 Tummala, R R, Rymaszewski, E J,and Klopfenstein, A G (eds), Microelectronics Packaging Handbook, Chapman and Hall, 1997 10 Lau, J H (ed), Ball Grid Array Technology, McGraw-Hill, 1995 11 Darveaux, R, Effect of Simulation Methodology on Solder Joint Crack Growth Correlation, Electronic Components and Technology Conference, 2000, pp 1048 1058 12 Anand, L, Constitutive Equations for Hot-Working of Metals, International Journal of Plasticity, Vol 1, 1985, pp 213 231 13 Bradley, Edwin (Motorola), Handwerker, Carol (NIST), and Sohn, John E, NEMI Report: A Single Lead-Free Alloy is Recommended, SMT, January 2003, cover story 14 Pei, M, and Qu, J. , Constitutive Modeling of Lead-Free Solders, Proceedings of IPACK 2005, 73411, 2005 15 Rodgers, Bryan, Flood, Ben, Punch, Jeff, and Waldron, Finbarr, Determination of the Anand Viscoplasticity Model Constants for SnAgCu, Proceedings of IPACK 2005, 73352, 2005 16 Ng, Hun Shen, Tee, Tong Yan, Goh, Kim Yong, Luan, Jing-en, Reinikainen, Tommi, Hussa, Esa, and Kujala, Arni, Absolute and Relative Fatigue Life Prediction Methodology for Virtual Qualification and Design Enhancement of Lead-Free BGA, Electronic Components and Technology Conference, 2005, pp 1282 1291 17 Clech, Jean-Paul, An Extension of the Omega Method to Primary and Tertiary Creep of Lead-Free Solders, Electronic Components and Technology Conference, 2005, pp 1261 1271 18 Shangguan, Dongkai, Lead-Free Solder Interconnect Reliability, ASM International, July 2006, pp 185 198 19 Weise, S, and Muesel, E Characterization of Lead-Free Solders in Flip Chip Joints, Journal of Electronic Packaging, Vol 125, December 2003, pp 531 538 20 Weise, S. , Muesel, E, and Wolter, K J, Microstructural Dependence of Constitutive Properties of SnAg and SnAgCu Solders, Electronic Components and Technology Conference, 2003, pp 197 206 21 Pang, J H L, Xiong, B S, and Low, T H, Creep and Fatigue Characterization of Lead-Free 955Sn38Ag-07Cu, Electronic Components and Technology Conference, 2004, pp 1333 1337 22 NIST, Materials for Microelectronics, , March 2004, available online at http://www metallurgynistgov/solder/ 23 Pan, N, Henshall, G A, Billaut, F, Dai, S, Strum, M J, Lewis, R, Benedetto, E, and Rayner, J, An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability under Various Thermal Cycle Conditions, SMTA International, 2005, pp 876 883 24 Clech, Jean-Paul, Acceleration Factors and Thermal Cycling Test Efficiency for Lead-Free Sn-Ag-Cu Assemblies, SMTA International, 2005 25 Bartelo, J. rdlc ean 128 VB.NET GS1 - 128 (UCC/ EAN 128 ) Generator SDK - Generate ...
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