rdlc data matrix

rdlc data matrix

rdlc data matrix

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FIGURE 59.19 Three-dimensional quarter-symmetry model showing an FCBGA package mounted on a PWB between support anvils. Contact elements between the anvils and the PWB simulate the flexure of the PWB as one anvil set is moved vertically relative to the other. Detail A of the model is shown in Fig. 59.20.

Bend test FEA simulations achieve two primary objectives:

To determine the relationship between PWB strain and critical joint strain. This in turn helps bridge differences between the controlled conditions in which the bend testing is performed and the conditions in which bending occurs during assembly. To perform a comparative assessment of different packages. FEA can be used to derive solder joint strains from experimental PWB strain data for different test conditions.

The FEA model is shown in Figs. 59.19 and 59.20. Solid structural elements are used to model the PWB, solder joints, and package details. Based on the premise that at high strain rates, the solder material becomes brittle and behaves almost like a linear elastic material, the solder joint elements are modeled as linear elastic. Contact elements are used at the interface between the PWB and anvils to simulate contact between the PWB and the anvils as the assembly is deformed. The solder joint geometry is modeled as closely as possible to the solder joints actual shape after reflow.

FIGURE 59.20 Detail A of the image model shown in Fig. 59.19. The image on the left shows the package (quarter-symmetry). The zoomed-in image on the right shows all the details of the FCBGA package construction.

Another common use case is to allow the end user to create a printable version of an application page. Drop a Show Printable Page Behavior component as a child component of a button or menu item. On clicking the button or menu item, a printable version of the page, minus command components such as menu bars and buttons, will be opened in a new browser window.

The creation of multiple cogs was covered in detail in Part I of the book. The data we need is added to the program with the following code in a DAT block:

A variety of different parametric analyses can be performed to determine the effect of different geometric variables on the critical joint strain. A few examples of such analyses are described in this section. 59.4.2.1 Strain Distribution Around the Package. Per IPC/JEDEC-9702, it is recommended that three strain gauges be placed around a package during four-point bend testing (see Fig. 59.21). These gauges are to be used to characterize the strain response of the given package

FIGURE 59.21 Nomenclature for the four-point bend test set up as outlined in IPC/JEDEC9702. Three strain gauges are placed on the board to measure the strain distribution around the package. Gauge 1 is placed under the package, directly below the corner most solder joint. Gauge 2 sits directly below the package center. Gauge 3 is placed next to the package on the PCB topside, midway between the package edge and the anvil.

Board Strain vs Joint Strain - 2.35mm Thick PCB 4500 4250 4000 3750 3500 3250 3000 2750 Board Strain 2500 2250 2000 1750 1500 1250 1000 750 500 250 0 0 2500 5000 7500 10000 12500 15000 17500 20000 22500 25000 27500 30000 32500 Joint Strain

FIGURE 59.22 Solder joint-to-PWB strain relationship for three gauge locations. The results indicate that the gradient at locations 1 and 3 are relatively close. The gradient at location 2 is quite low. This indicates that the PWB strain at location 2 is least sensitive to variations in critical solder joint strain. The nomenclature for the strain gauge locations is given in Fig. 59.21.

Below Joint (Loc 1) Package Center (Loc 2) 11.25 mm From Joint (Loc 3)

DAT Tone word 440, 494, 523, 587, 659, 698, 784, 880