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There are a number of properties that you can set to control features like icons and labels. For example, on a Button component, you can define Text, Icon, and IconPosition, as shown for the Previous and Next buttons in Figure 14-1. You can also set AccessKey to define a quick

Zero etchback, when innerlayer foil is flush with the hole wall, is the most dangerous case because the bond line between the foil and the plated copper is located at the point of maximum stress28 Causes of insufficient etchback include improper lamination and curing, hardened epoxy smear, a depleted smear removal bath, or a host of process control issues, including improper bath temperature, agitation, or time exposure..

FIGURE 57.16 Schematic illustrations of positive, flush, and negative etchback. (After M.W. Gray.28)

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Program 14-1 will be improved upon, added to, and then broken up into its various methods as our skills improve. Once we have worked up a comprehensive set of methods, the methods will be placed in an object called LCDRoutines4, from where we will be able to call whatever method we need in any of the programs we develop. You do not have to worry about the details of this at this time. It will all be explained later in 21. The final versions of the programs LCDRoutines4 and Utilities are also listed in Appendix A. LCDRoutines4 is the 4-bit version of LCDRoutines. The Spin language is designed to allow the easy sharing of previously developed programs by third-party users. You are welcome to use any of the software developed in this book for use in any way you see fit as per the terms of the MIT license described in the preface of this book. You should also develop some expertise in using other objects in the object exchange maintained by Parallax so that you do not have to reinvent the wheel from time to time. Get familiar with the object exchange. It is a very useful resource for beginners.

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java code 39 generator

generate code39 barcode data in java? - Stack Overflow
According to Wikipedia Code 39 is restricted to 43 characters.In order to generate it's encoding data I've used the following code:

57.4.1.4 Plating. Defects from the plating process can be responsible for a variety of PTH reliability problems; in addition, as previously described, problems in earlier process steps such as drilling and desmear often show up as plating defects. Uniform coverage of the hole with electroless Cu is critical to the strength of the throughhole and the adhesion of the metallization to the laminate. Oxidation of the innerlayer copper prior to electroless Cu plating is one source of poor plating adhesion. Poor control of bath composition can have the same effect. The adhesion of the electroplated Cu to the electroless Cu and the ductility of the electroplated Cu also strongly affect PTH reliability. If the adhesion between the layers is poor, this interface may be the weak point where failure initiates when the PTH is subjected to thermal stresses. Causes can include tarnished electroless copper that is insufficiently microetched, burning the electroless copper with too much current in electrolytic plating, and film contamination

in the electrolytic copper28 Susceptibility to innerlayer cracks may be identified by looking for cracks in microsections after a solder float test The fatigue life of the copper is directly related to its ductility Plating process parameters and plating additives can strongly affect the plating ductility For example, Mayer and Barbieri29 found that good thermal shock resistance of electrodeposits of acid copper depended on proper concentrations of three additives: 1 A leveling agent, to smooth over surface imperfections (Without the leveling agent imperfections are reproduced in the deposit) 2 A ductility-promoting agent, which functions to produce the equiaxed grain structure 3 A carrying agent, to guide the other two components to create the equiaxed structure (Striations occurred with insufficient carrying agent) Additive levels below a certain threshold make the bath more susceptible to impurity effects.

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