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However, there are two primary concerns with ENiG: 1 Brittle Fracture This failure mode is seen in high strain/strain rate conditions, such as shipping, testing, and handling A typical signature of this failure mode is a clean separation in the intermetallic between the pad and the solder joint This failure typically has a low defect rate in production, but the ensuing line stops, customer returns, and root-cause analyses are quite expensive Moreover, the unpredictability of the failure and the susceptibility to mechanical handling/testing/shipping conditions makes it quite undesirable There are a few failure mechanism theories proposed to explain brittle fracture,18 but no conclusive failure mechanism has been agreed upon in the industry The predominant theory is based on the formation of Kirkendall voids during reflow, in the phosphorus-rich Ni layer and Sn-Ni intermetallic interface Kirkendall voids are voids that form at the interface of two dissimilar materials. birt ean 128 Bar code EAN - 128 Font in BIRT Reports — OpenText - Forums
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11 Dec 2012 ... Eclipse Birt Barcode Generator Add-In was developed exclusively by ... Supported linear barcodes: Code 39, Code 128 , EAN - 128 / GS1 128 , ... 'These pins control the motor amp 'turn off the amp brake (continued) They form because the two materials diffuse into each other at different rates Other factors such as the concentration of P in the Ni-P+ layer and the density of mudflat cracks in the Ni-P+ layer have also been shown to have an influence on the propensity of brittle fracture The intermetallics formed in the joint during the assembly process are shown in Fig 5818 The presence of pervasive Kirkendall voids could reduce the strength of the solder joint A mechanically applied strain could result in the sort of brittle solder joint failure shown in Figs 5819 and 5820.. birt gs1 128 BIRT » barcode via Dynamic Image - Eclipse Community Forums
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BIRT , Barcode, Barcodes, Plugin, QRCode, QR Code, EAN, UPC, EAN13, EAN128 , EAN8, UPCA, UPCE, TM3 Software. Ni-Cu-Sn Intermetallic Another phenomenon reported to cause a similar failure is based on the formation of a Ni-Cu-Sn ternary intermetallic in the solder joint.20 The Ni-Sn intermetallic forms on the component side during ball attach. When the part is mounted on the board, copper migrates from the board pad side, across the BGA ball, to form a Ni-Cu-Sn intermetallic on the component side. The thickness of this ternary intermetallic, typically 3 to 5 mm thick, could grow with additional reflows.20 Clearly, an important factor contributing to this phenomenon is the surface finish on the PWB side. If the surface finish has a barrier like Ni to prevent copper from migrating across the BGA ball, this ternary intermetallic is less likely to form on the component side. Strain/Strain Rate It has also been observed that the strain to failure of solder joints is a strong function of the strain rate. The higher the strain rate, the lower the strain-to-failure. One theory to explain this strain rate dependency is that the stiffness of bulk solder itself is strain rate dependent: at low strain rates, solder tends to deform and absorb some of the applied strain. Thus, less strain is actually transferred to the Kirkendall void-rich region. At high strain rate levels (typically above 5000 u /sec.), bulk solder behaves more like a linear elastic material and transfers more of the applied strain to the voids, causing brittle solder joint fracture. A graph illustrating the relationship between strain and strain rate for solder joint failure is given in Chap. 59. birt gs1 128 BIRT Barcode Plugin for eclipse BIRT versions 2.x, 3.x and 4.x ...
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Generate high quality GS1 128 ( EAN 128 ) images in Java by encoding GS1 ... Eclipse BIRT and Oracle Reports; Royalty free with the purchase or Java EAN 128 ... Ni2-P-Sn Sn-Pb (b) Sn-Pb Cu3-Sn (c) FIGURE 58.18 Solder joint intermetallic formation. (a) The constituent material stack up in a BGA substrate land pad. (b) After the ball is attached, a number of intermetallics are formed between the copper pad and the SnPb solder joint. Kirkendall voids are known to form at the phosphorus-rich Ni layer and Sn-Ni intermetallic interface. (c) After board level reflow, the interface region thickens and several more intermetallics are formed.19 (Reprinted with permission from Renesas Technology Corp./ [2003] IEEE ECTC.) Application notes that cover more specialized aspects of the chip s operation are posted on the Parallax website for downloading at no charge. The discussion forums maintained by Parallax provide additional support that gives you access to everything you need at your level of expertise and understanding. The discussion forums are active, and a number of informed individuals both from within the Parallax organization and outside it post regularly. The range of what people are doing with the Propeller is extensive and impressive, even amazing. I urge you to read these forums regularly and participate in them as often as the need arises. Parallax also provides live person on the phone technical support for the Propeller chip at no charge! FIGURE 58.19 Brittle Solder Joint Failure.19 A clear separation between the P-rich phase and IMC on the package side is shown. (Reprinted with permission from Renesas Technology Corp./ [2003] IEEE ECTC.) Now that you are armed with an understanding of the building blocks of ADF Business Components, the next step is to put that knowledge into action and build ADF Business Components based on database tables. There are a number of different ways to build ADF Business Components; however, JDeveloper provides an incredibly powerful wizard that creates entity objects, associations, view objects, view links, and an application module, based on a number of database tables, all in one go. This is a great way of getting a first cut of your business services. FIGURE 58.20 Intermetallics Formed In Solder Joint with Brittle Fracture.19 (Reprinted with permission from Renesas Technology Corp./ [2003] IEEE ECTC.) birt ean 128 Java GS1 - 128 (UCC/ EAN - 128 ) Barcodes Generator for Java
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