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58.3.3 Board Stiffness Effect As with the double-sided case described earlier, solder joint reliability generally decreases with PWB thickness. The thicker the PWB, the higher its stiffness, and the higher the differential strain that the solder joints have to absorb. However, the percent reduction in solder joint fatigue life due to board thickness varies for different package constructions (for example, CCGA, CSP, FCBGA, and PBGA).5 The reduction is more pronounced in ceramic packages as compared to organic packages because of the higher mismatch in the coefficient of thermal expansion (CTE) between the package and PWB. Both thickness and number of layers of copper contribute to the stiffness of a PWB. As a result, the PWB thickness and layer count used to perform qualification testing should be representative of the end-use conditions in which the package would be used. 58.3.3.1 Effect of Lead-Free Conversion. The negative effect of PWB stiffness on solder joint reliability also applies to lead-free assemblies, as evidenced in Fig. 58.11. However, the amount of degradation could be different depending on the package type. Best practice recommendation is to use two different board thicknesses to perform temperature cycling qualification. This helps generate data for a specific package type over a range of board thicknesses. This recommendation is in line with the guidelines in the industry standard IPC 9701.6 asp.net pdf 417 ASP . NET PDF-417 Barcode Generator - Generate 2D PDF417 in ...
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Easy-to-use ASP . NET PDF417 Barcode Component, generating PDF-417 barcode images in ASP.NET, C#, VB.NET, and IIS project. Program 28-5 1300 Predicted Mean Life (cycles) 1200 1100 1000 900 800 0.8 1.0 1.2 1.4 1.6 Board Thickness (mm) 1.8 FIGURE 58.11 Effect of board thickness on solder joint reliability of stacked lead-free extremely thin CSP (PS-etCSP). (Reprinted with permission from Amkor Technology, Inc./ [2004] IEEE ECT 4) asp.net pdf 417 PDF417 ASP . NET - Barcode Tools
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2 May 2019 ... NET framework. It is the second article published by this author on encoding and decoding of PDF417 barcodes. The first article is PDF417 ... High Density Due to Multiple Packages in a Small Area A second source of reliability degradation due to density increase can be observed when a designer attempts to place many BGA packages in a small area on a thin PWB (see Fig. 58.12). The effective CTE of the packaged die or module tends to be much lower than that of the actual PWB. During reflow, the PWB and packages are in a stress-free state. Upon cooling, however, the packaged die contracts at a reduced rate (due to the lower effective CTE) than the underside of the PWB, causing a convex-type curvature to be imparted to the PWB. Moreover, if the thermal mass of the packages on the top side is higher than that on the bottom side, this can lead to a skew in the temperature distribution across the assembly, which in turn exacerbates the warpage of the assembly. Thus, care should be taken to distribute the packages as uniformly as possible across the PWB on both sides, and also to balance the copper in the PWB itself. asp.net pdf 417 ASP . NET Barcode Demo - PDF417 Standard - Demos - Telerik
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It can work with Code128, PDF417 and many other symbologies. ... annoyingly split it along technology lines ( Barcode Professional "...for ASP . FIGURE 58.12 High-density placement of BGAs on top side of a PWB. This diagram illustrates the convex-type curvature of a PWB assembly where multiple BGA devices are all placed on one side of a board. 58.3.4.1 Effect of Lead-Free Conversion. Typical lead-free reflow temperatures (235 to 260 C) are higher than tin-lead reflow temperatures (220 C). As a result, the residual stresses built into the assembly after reflow could be higher in lead-free assemblies. These higher residual stresses are also a function of the cooling rate. Thus, it is important to not only control the heating side of the reflow profile, but the cooling side as well.The use of multiple zones for cooling is preferable, as it ensures better control. Moreover, forced convection ovens would be preferable over IR ovens for better control. Due to significant variations in the thermal mass of typical boards, it is difficult to provide universally applicable recommendations on reflow profiles. {{4 Sep 09 Harprit Sandhu HoldMotorPotSpd.Spin Propeller Tool Version 1.2.6 28 Program 05 This program controls the speed of the motor from a potentiometer. You may have to adjust the gain variable for your particular motor. Connections are Amplifier brake Amplifier PWM Amplifier direction Potentiometer LCD on the usual Revisions Oct 09 08 Dec 24 09 asp.net pdf 417 Create PDF 417 barcode in asp . net WEB Application | DaniWeb
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